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the situation, we need to know very well what comprises a rosin that is typical solder fume. A typical solder fume is a mixture of very small particles (smoke) and gases which may be explained as around 95% particulates (the real smoke plume), and around 5% gases and vapours that may include a cocktail of Acetones, Methyl Alcohol, Formaldehyde, Carbon Dioxide, Diterpine Acid, Carbon Monoxide and Isopropyl Alcohol. Note: Even 'Synthetic' and 'No Clean' fluxes can lead to severe lung irritation
As soon as inhaled, the lung area cannot easily remove particle sizes under 10 microns. In the event that you knew a peoples locks is approximately 100 microns in diameter, look at this - the largest solder fume particle is just about 10 microns in diameter plus the smallest is around 0.3 microns (you can simply see 30 microns by having a nude eye).
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5. Drilling - the process of drilling most of the holes for plated through applications; a second drilling procedure is employed for holes which are not become plated through. Info on hole location and dimensions are contained in the drill drawing file.
6. Plating - the process of applying copper plating towards the pads, traces, and drilled through holes which are to be plated through; boards are placed in an
bath of copper.
7. Second Drilling - this is required when holes can be drilled by way of a copper area but the gap isn't become plated through. Avoid this process when possible because it adds
to the board that is finished.
8. Masking - the process of applying a protective masking product, a solder mask, on the bare copper traces or over the copper who has possessed a slim layer of solder applied; the solder mask protects against environmental damage, provides insulation, protects against solder shorts, and protects traces that run between pads.
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